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Penerangan Produk
The HJ30J Series Micro Rectangular High-Speed Connectors are designed for high-density, high-speed board-to-board interconnections in chassis and cabinet-level applications, offering excellent electrical performance and mechanical reliability in harsh environments.
Ciri-ciri utama
- Flexible stranded pin contacts for enhanced reliability
- High-density contact layout with 1.27 mm × 1.27 mm pitch
- Metal shielding shell for superior EMI protection
- Available in 7 shell sizes: 12, 18, 24, 30, 36, 55, 100 contacts
- Ideal for high-speed signal transmission between boards
Spesifikasi teknikal
| Parameter | spesifikasi |
| Suhu Operasi | -55 ° C hingga + 125 ° C |
| Impedans ciri | 100 ±15 Ω |
| Kedudukan semasa | 3 A |
| Hubungi rintangan | ≤ 20 mΩ |
| Dielektrik menahan voltan | 800 V (suhu bilik) |
| rintangan penebatan | ≥ 5000 MΩ (500 VDC); ≥ 100 MΩ (wet heat) |
| Data transmission rate | Hingga 1.65 Gbps |
| Kehidupan mekanikal | 500 kitaran mengawan |
| Getaran | 10–2000 Hz, 196 m/s² |
| Kejutan | 735 m / s² |
